Liquid crystal display device, method for fabricating the same, and portable telephone using the same

ABSTRACT

A liquid crystal display device comprises a liquid crystal display panel and a semiconductor integrated circuit for driving and controlling the liquid crystal display panel. The number of input/output wires connected to I/O terminals (bonding pads) of the semiconductor integrated circuit is reduced so as to simplify wiring patterns of the I/O wires, whereby degrees of freedom in arranging the I/O wiring patterns are enhanced. The panel has a pair of insulating substrate, and the semiconductor integrated circuit is mounted on one of the paired substrates. The semiconductor integrated circuit has a mode terminal which is fixed to a power supply potential or to a reference potential during operation of the integrated circuit, and power supply dummy terminals connected to the power supply potential or reference potential inside the semiconductor integrated circuit. The wiring patterns formed on the paired insulating substrates connect the mode terminal to the power supply dummy terminals.

TECHNICAL FIELD

[0001] The present invention relates to a liquid crystal display deviceand, more particularly to a liquid crystal display device with a reducednumber of input/output wires connected to input/output terminals of asemiconductor integrated circuit for controlling and driving a liquidcrystal display panel.

BACKGROUND ART

[0002] Liquid crystal display (LCD) devices are characterized in thatthey are fabricated in a very thin form, are driven on a low voltage andconsume only small quantities of power. Blessed with such features, alarge number of LCD devices have been used extensively in variouselectronic apparatuses. Of these display devices, those particularlysmall in size have been adapted for use on electronic calculators anddigital watches. In recent years, such small display devices are alsofinding their way into portable telephones.

[0003] For use on portable telephones, small-sized LCD devices aregenerally simple matrix LCD devices operating in one of two modes:twisted nematic (TN) mode, or super twisted nematic (STN) mode.

[0004] A simple matrix LCD device of a known type used on the portabletelephone is an LCD module composed of an LCD panel and an LCDcontroller made of a single semiconductor integrated circuit to controlthe panel, the components being connected by a chip-on-glass (COG)arrangement.

[0005] More specifically, the chip-on-glass type LCD module has an LCDpanel with liquid crystal interposed and sealed between a pair of glasssubstrates. On one of the two glass substrates constituting the LCDpanel is an LCD controller (LSI) made of a single semiconductorintegrated circuit.

[0006] The LCD controller-mounted glass substrate is formed integrallywith liquid crystal output wires and input/output wires. The liquidcrystal output wires are connected to liquid crystal output terminals ofthe LCD controller so that the controller may output liquid crystaldriving voltages (segment and common voltages) to electrodes (segmentand common electrodes) inside the LCD panel. The input/output wires areconnected to input/output terminals of the LCD controller so thatvarious signals are input to and output from the controller. Theinput/output wires are drawn to an edge of the controller-mounted glasssubstrate and connected there to a printed circuit board that comprisesa central processing unit (CPU) and other components.

[0007] As outlined above, the chip-on-glass type LCD module has an LCDpanel, an LCD controller (LSI), liquid crystal output wires andinput/output wires, all mounted on a single glass substrate. Thisconstitution contributes to making external dimensions of the LCD modulesmaller than before. This type of LCD module is discussed illustrativelyin Japanese Unexamined Patent Publication Nos. Hei 6-118433 and Sho63-191130.

[0008] In the chip-on-glass type LCD module, the liquid crystal outputwires formed on one of the paired glass substrates are connecteddirectly to the LCD panel. The direct connection eliminates problemsassociated with the routing of the liquid crystal output wires.

[0009] In general, the input/output wires formed on one of the glasssubstrates are drawn out of the input/output terminals of the LCDcontroller (LSI) up to an edge of the glass substrate without beingcrossed halfway. If the arrangement of the input/output terminals of theLCD controller differs from the arrangement of the input/outputterminals of the printed circuit board, then it becomes necessary tocross illustratively signal conductors and power supply wires. Thesignal conductors supply various signals to the LCD controller andreceive output signals from the controller, and the power supply wirescarry a supply voltage (V_(CC)) or a reference potential (G_(ND)). Thecrossing of the wires and conductors, if carried out, necessitatescomplicated rerouting of the wiring inside the printed circuit board.

[0010] In this connection, an LCD controller (LSI) with mode terminalsfor changing its internal status (operation mode or device IDinformation) has a distinctive wiring characteristic. That is, allinput/output wires including those connected to the mode terminals aredrawn out, without crossing, to an edge of one of the glass substrates.The mode terminals are connected through the printed circuit board toits power supply wires carrying the supply voltage (V_(CC)) or referencepotential (G_(ND)) for the board in question, whereby the mode terminalsare continuously pulled up to the supply voltage (V_(CC)) or pulled downto the reference potential (G_(ND)).

[0011] In the above setup, it is necessary to install a large number ofinput/output wires on one of the glass substrates of the LCD moduleincorporating the LCD controller (LSI) having the mode terminals. Theneed to install the numerous wires complicates wiring patterns of theinput/output wires and lowers degrees of freedom in arranging the wiringpatterns. The interposed presence of the printed circuit board in suchwiring further confounds rerouting arrangements.

[0012] It is therefore an object of the present invention to provide aliquid crystal display device and a method for fabricating the device,whereby the number of input/output wires connected to input/outputterminals of a semiconductor integrated circuit is reduced so thatpatterns of input/output wiring are simplified and that degrees offreedom in arranging the input/output wiring patterns are enhanced.

[0013] It is another object of the present invention to provide a liquidcrystal display device and a method for fabricating the device, wherebythe number of input/output wires connected to input/output terminals ofa semiconductor integrated circuit in the device is reduced so that thedevice as a whole has reduced external dimensions and that the cost offabricating the device is lowered.

[0014] It is a further object of the present invention to provide aportable telephone such that its external dimensions are reduced andthat the cost of fabricating the telephone is lowered through the use ofan inventive liquid crystal display device.

[0015] Further objects and advantages of this invention will becomeapparent from a consideration of the accompanying drawings and ensuringdescription of it.

DISCLOSURE OF THE INVENTION

[0016] A summary of typical ones of the invention disclosed in thepresent application will be described in brief in the following manner.

[0017] According to the invention, there is provided a liquid crystaldisplay device comprising a liquid crystal display panel and asemiconductor integrated circuit for controlling and driving the liquidcrystal display panel, the semiconductor integrated circuit furtherhaving a mode terminal fixed to either a power supply potential or areference potential during operation of the semiconductor integratedcircuit, wherein the semiconductor integrated circuit includes powersupply dummy terminals connected at its inside to either the powersupply potential or the reference potential, and the mode terminal isconnected to the power supply dummy terminals.

[0018] The inventive device may further comprise a plurality of modeterminals, wherein the plurality of mode terminals and the power supplydummy terminals may be disposed alternately.

[0019] The liquid crystal display panel may have a pair of insulatingsubstrates, and one of the pair of insulating substrates may be mountedwith the semiconductor integrated circuit and have wiring patternsformed so as to connect the mode terminal to the power supply dummyterminals.

[0020] The semiconductor integrated circuit may comprise a plurality ofdummy terminals interconnected by a wiring layer inside thesemiconductor integrated circuit.

[0021] According to the invention, there is provided a method forfabricating a liquid crystal display device including a liquid crystaldisplay panel and a semiconductor integrated circuit, the liquid crystaldisplay panel having a pair of insulating substrates, the semiconductorintegrated circuit being mounted on one of the insulating substrates todrive the liquid crystal display panel, the semiconductor integratedcircuit further comprising a mode terminal and power supply dummyterminals, the mode terminal being fixed to either a power supplypotential or a reference potential during operation of an integratedcircuit, the power supply dummy terminals being connected to either thepower supply potential or the reference potential inside thesemiconductor integrated circuit, the mode terminal being connected tothe power supply dummy terminals, the method comprising the steps of:forming wiring patterns on the pair of insulating substrates; injectingand sealing liquid crystal between the pair of insulating substrates;and bonding the semiconductor integrated circuit to one of the pair ofinsulating substrates so that the wiring patterns formed on the pair ofinsulating substrates will connect the mode terminal to the power supplydummy terminals.

[0022] According to the invention, there is provided a portabletelephone comprising a liquid crystal display device according to theinvention.

[0023] In the inventive liquid crystal display device, the semiconductorintegrated circuit includes mode terminals that are fixed to the powersupply potential or reference potential during operation. Inside thesemiconductor integrated circuit, the mode terminals are connected topower supply dummy terminals which in turn are connected to the powersupply potential or reference potential. This connective arrangementreduces the number of input/output wires connected to input/outputterminals of the semiconductor integrated circuit, whereby externaldimensions of the liquid crystal display device are reduced and itsmanufacturing cost is lowered.

[0024] The inventive liquid crystal display device may have a pluralityof mode terminals and the power supply dummy terminals disposedalternately. This layout permits simplified connection between the modeterminals and power supply dummy terminals.

[0025] The wiring patterns formed on the insulating substrates may bearranged to connect the mode terminals to the power supply dummyterminals. The arrangement reduces the number of input/output wiresconnected to input/output terminals of the semiconductor integratedcircuit, whereby the input/output wiring patterns on the insulatingsubstrates are simplified and degrees of freedom in arranging theinput/output wiring patterns are enhanced.

[0026] In the inventive liquid-crystal display device, the semiconductorintegrated circuit may include a plurality of dummy terminalsinterconnected by a wiring layer inside the integrated circuit. Thedummy terminals permit crossing of input/output wires connected to theinput/output terminals of the semiconductor integrated circuit.

[0027] Furthermore, the inventive liquid crystal display device may beused as displaying means of a portable telephone. The use of such adisplay device allows the portable telephone to be reduced in externaldimensions and fabricated at lower cost than before.

BRIEF DESCRIPTION OF THE DRAWINGS

[0028]FIG. 1 is a block diagram of a chip-on-glass type liquid crystaldisplay module (LCM) embodying the invention;

[0029]FIG. 2 is a perspective view of a liquid crystal display panel(LCD) in the module of FIG. 1;

[0030]FIG. 3 is a partial cross-sectional view outlining a constitutionof the LCD panel in FIG. 1;

[0031]FIG. 4 is a partial cross-sectional view outlining anotherconstitution of the LCD panel in FIG. 1;

[0032]FIG. 5 is a plan view of wiring patterns of a transparentconductive film (ITO) on a glass substrate 1 in association with segmentelectrodes 11 and common electrodes 12;

[0033]FIG. 6 is a schematic view outlining a structure of a connectingregion 25 shown in FIG. 5;

[0034]FIG. 7 is a schematic view outlining another structure of theconnecting region 25 in FIG. 5;

[0035]FIG. 8 shows partial cross-sectional views depicting steps forfabricating the liquid crystal display module (LCM) embodying theinvention;

[0036]FIG. 9 shows partial cross-sectional views depicting further stepsfor fabricating the liquid crystal display module (LCM) embodying theinvention;

[0037]FIG. 10 is a schematic view showing how input/output terminals andfunction modules inside an LCD controller (LSI) are laid out in theembodiment of the invention;

[0038]FIG. 11 is a circuit diagram of an internal circuit connected tomode terminals 41 of the LCD controller in the embodiment;

[0039]FIG. 12 is a block diagram showing function blocks inside the LCDcontroller of the embodiment;

[0040]FIG. 13 is a graphic representation illustrating typical behaviorof segment voltages fed to segment electrodes 11 and of common voltagessupplied to common electrodes 12 under a time division drive scheme ofthe embodiment;

[0041]FIG. 14 shows graphic representations depicting typical behaviorof the segment voltage fed to the segment electrodes 11 and of thecommon voltage supplied to the common electrodes 12 under a static drivescheme of the embodiment;

[0042]FIG. 15 is a schematic view of power supply wiring inside asemiconductor integrated circuit (LSI) of the embodiment;

[0043]FIG. 16 is a schematic view illustrating specific wiring patternsof a transparent conductive film (ITO) on that portion of a glasssubstrate 1 which carries an LCD controller (LSI), the patterns beingshown relative to the LCD controller;

[0044]FIG. 17 is a cross-sectional view taken on line A-A′ in FIG. 16where a terminal ID1/CS* and a power supply dummy terminal VCCDUMMY2 areconnected, the view including a cross-section of the LCD controller(LSI);

[0045]FIG. 18 is a schematic view indicating other specific wiringpatterns of the transparent conductive film (ITO) on that portion of theglass substrate 1 which carries the LCD controller (LSI), the patternsbeing shown relative to the LCD controller;

[0046]FIG. 19 is a cross-sectional view taken on line B-B′ in FIG. 18where dummy terminals DAY16 and DAY17 are connected, the view includinga cross-section of the LCD controller (LSI);

[0047]FIG. 20 is a block diagram outlining a conventional PHS systemthat utilizes the liquid crystal display module (LCM) embodying theinvention;

[0048]FIG. 21 is a schematic view illustrating a portable telephone thatincorporates the liquid crystal display module (LCM) embodying theinvention;

[0049]FIG. 22 is a schematic view showing a chip-on-board (COB) typeliquid crystal display module (LCM) embodying the invention;

[0050]FIG. 23 is a schematic view depicting a tape-carrier-package (TCP)type liquid crystal display module (LCM) embodying the invention; and

[0051]FIG. 24 is a schematic view showing a structure of pad-to-padconnection wiring 25 included in the embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION

[0052] Preferred embodiments of this invention will now be describedwith reference to the accompanying drawings.

[0053] Throughout the drawings, like reference characters designate likeor corresponding parts, and their descriptions are omitted where theyare repetitive.

[0054]FIG. 1 is a block diagram of a chip-on-glass type liquid crystaldisplay module (LCM) embodying the invention. As illustrated, the liquidcrystal display module includes a liquid crystal display panel (LCD).The panel has a liquid crystal layer injected and sealed between a pairof glass substrates 1 and 2 bonded together, with a sealing material 3interposed therebetween.

[0055] An LCD controller (LSI) composed of a single large-scalesemiconductor integrated circuit is mounted on the glass substrate 1.Also mounted on the glass substrate 1 are liquid crystal output wiresand input/output wires. The liquid crystal output wires are connected toliquid crystal output terminals of the LCD controller (LSI) so that thecontroller may output liquid crystal driving voltages (segment voltageand common voltage) to electrodes (segment electrodes and commonelectrodes) inside the LCD panel. The input/output wires are connectedto input/output terminals of the LCD controller (LSI) so as to input andoutput various signals to and from the controller. The liquid crystaloutput wiring and input/output wiring are formed by a transparentconductive film (indium-tin-oxide or ITO).

[0056] The input/output wires are drawn out to an edge of the glasssubstrate 1 and connected there to a heat seal (printed circuit board)4, whereby the wires are connected to the printed circuit board carryinga central processing unit (CPU) and other components.

[0057] The LCD controller mounted on the glass substrate 1 is bondedface down to the transparent conductive film (ITO comprisinginput/output and liquid crystal output wires) on the glass substrate 1.Gold bumps deposited on pads of the LCD controller connect the latter tothe transparent conductive film.

[0058]FIG. 2 is a perspective view of a typical liquid crystal displaypanel (LCD) in the module of FIG. 1, and FIG. 3 is a partialcross-sectional view outlining a typical constitution of the LCD panelin FIG. 1.

[0059] The LCD panel shown in FIGS. 2 and 3 is an STN type LCD panel. Asillustrated, the LCD panel has a plurality of segment electrodes 11 madeof a striped transparent conductive film (ITO) on the side of the glasssubstrate 1, and a plurality of common electrodes 12 also formed by astriped transparent conductive film (ITO) on the side of the glasssubstrate 2, the two groups of electrodes being separated by a liquidcrystal layer 10. The plurality of segment electrodes 11 and an orientedlayer 13 are stacked inside the glass substrate 1 (on liquid crystallayer side), and the plurality of common electrodes 12 and anotheroriented layer 14 are stacked inside the glass substrate 2 (also onliquid crystal layer side). A deflection plate 15 and a phase differenceplate 17 are formed outside the glass substrate 1, and anotherdeflection plate 16 is provided outside the glass substrate 2.

[0060] The segment electrodes 11 and common electrodes 12 are at rightangles to one another. Intersections between the segment electrodes 11and the common electrodes 12 constitute pixel regions.

[0061] It is possible to provide spacers within the liquid crystal layer10 to keep the latter's gap length constant. The LCD panel shown inFIGS. 2 and 3 is equipped with a backlight arrangement under the glasssubstrate 1. The backlight illuminates the LCD panel from behind.

[0062]FIG. 4 is a partial cross-sectional view outlining anotherconstitution of the LCD panel in FIG. 1. The LCD panel in FIG. 4 is areflective TN type liquid crystal display panel. An internal structureof the LCD panel shown in FIG. 4 is basically the same as that of theLCD panel in FIG. 3. The difference is that the LCD panel in FIG. 4 hasthe deflection plate 15 furnished outside the glass substrate 1 and hasthe deflection plate 16 and a reflection plate 18 provided outside theglass plate 2.

[0063]FIG. 5 is a plan view of wiring patterns of the transparentconductive film (ITO) on the glass substrate 1. The patterns are shownin association with the segment electrodes 11 and common electrodes 12.

[0064] In FIG. 5, the LCD controller (LSI) is bonded face down to aportion enclosed by broken lines. Gold bumps deposited on pads of theLCD controller connect the latter to the transparent conductive film(ITO). The liquid crystal output wires feeding the segment voltage tothe segment electrodes 11 and the common voltage to the commonelectrodes 12 in the LCD panel are divided into two groups: output wires20 on the segment side, and output wires 21 on the common side.

[0065] Most of the segment-side liquid crystal output wires 20 areformed integrally and continuously with the segment electrodes 11 in theLCD panel. Those portions of the segment-side liquid crystal outputwires 20 which are located inside the LCD panel constitute the segmentelectrodes 11. The common-side liquid crystal output wires 21 aresubdivided into upper common-side liquid crystal output wires 21 a andlower common-side liquid crystal output wires 21 b. Part of thesegment-side liquid crystal output wires 20 and the common-side liquidcrystal output wires (21 a and 21 b) are connected to the commonelectrodes 12 via connecting regions 25.

[0066]FIG. 6 is a schematic view outlining a typical structure of aconnecting region 25 shown in FIG. 5. In this structure, silver paste(AGP) is formed in the sealing material 3. The inclusion of the silverpaste in the sealing material 3 allows the common-side liquid crystaloutput wires (21 a and 21 b, or part of the segment-side liquid crystaloutput wires 20) to supply the common voltage to the common electrodes12. In such a case, the sealing material 3 and the silver paste (AGP)may be formed by known screen printing techniques.

[0067]FIG. 7 is a schematic view outlining another typical structure ofthe connecting region 25 in FIG. 5. In the structure of FIG. 7, thesealing material 3 is made of an anisotropic conductive material. Thesealing material 3 allows the common-side liquid crystal output wires(21 a and 21 b, or part of the segment-side liquid crystal output wires20) to supply the common voltage to the common electrodes 12.

[0068] The anisotropic conductive material forming the sealing material3 may illustratively be a synthetic resin having conductive beads 31dispersed therein. Suitably setting the amount of conductive beads 31dispersed in the synthetic resin prevents short-circuiting betweencontiguous common-side liquid crystal output wires (21 a, 21 b) andbetween the common electrodes 12 in the connecting regions 25.

[0069] The conductive beads 31 shown in FIG. 7 may be any of thosecoated with transparent conductive films, with metallic powder or withcarbon, or of metallic or otherwise conductive beads. In FIG. 7, theconductive beads 31 may be replaced by conductive fibers (ACF).

[0070] In FIG. 5, the input/output wires 22 are drawn out to an edge ofthe glass substrate 1 and connected there to the heat seal 4. The powersupply potential (V_(CC)) wiring in the input/output wires 22 has afirst region 23 formed extensively over the portion accommodating theLCD controller (LSI); the reference potential (G_(ND)) wiring in theinput/output wires 22 has a second region 24 also furnished extensivelyin the portion accommodating the LCD controller. The connecting regions25 in FIG. 5 are made of wires for interconnecting the pads of the LCDcontroller, as will be described later.

[0071]FIGS. 8 and 9 are partial cross-sectional views depicting steps tofabricate the liquid crystal display module (LCM) embodying theinvention. Described below with reference to FIGS. 8 and 9 is a methodfor fabricating the liquid crystal display module embodying theinvention.

[0072] (1) Step 1

[0073] The glass substrates 1 and 2 are cleaned (FIG. 8(a)).

[0074] (2) Step 2

[0075] An ITO film is formed by deposition or by sputtering over theglass substrate 2. Then the common electrodes 12 are formed byphotolithography on the film. In like manner, the segment electrodes 11,liquid crystal output wires (segment-side liquid crystal output wires 20and common-side liquid crystal output wires 21), input/output wires 22,first region 23, second region 24, and pad-to-pad connection wiring 25are formed over the glass substrate 1 (FIG. 8(b)).

[0076] (3) Step 3

[0077] The oriented films 13 and 14 are formed over the entire surfacesof the glass substrates land 2, including the surfaces of the segmentelectrodes 11 on the glass substrate 1 and of the common electrodes 12on the glass substrate 2. The forming of the oriented films is followedby a rubbing process (FIG. 8(c)).

[0078] (4) Step 4

[0079] The sealing material 3 is applied onto the periphery of the glasssubstrate 1 (FIG. 8(d)).

[0080] (5) Step 5

[0081] The pattern surfaces of the glass substrates 1 and 2 are puttogether. With the external surfaces of the glass substrates 1 and 2subjected to pressure, heat is applied so as to harden the sealingmaterial 3, whereby the glass substrates 1 and 2 are bonded together andsealed (FIG. 8(e)).

[0082] (6) Step 6

[0083] The liquid crystal layer 10 is injected through an opening 30 ofthe sealing material 3, and the opening 30 is sealed by epoxy resin orthe like. Then the deflection plate 15 and phase different plate 17 areformed outside the glass substrate 1, and the deflection plate 16 isformed outside the glass substrate 2 (FIG. 9(f)).

[0084] (7) Step 7

[0085] With the glass substrate 1 and LCD controller (LSI) suitablypositioned to each other, the controller is bonded face down to thesubstrate. The bonding connects gold bumps deposited on the pads of theLCD controller to the transparent conductive film (ITO) over the glasssubstrate 1. This in turn connects the pads of the LCD controller to theliquid crystal output wires (segment-side liquid crystal output wires 20and common-side liquid crystal output wires 21), to the input/outputwires 22, and to the pad-to-pad connection wiring 25 (FIG. 9(g)).

[0086] (8) Step 8

[0087] The input/output wires 22 drawn out to an edge of the glasssubstrate 1 and the heat seal 4 are suitably positioned to one another.Applying pressure and heat to the heat seal 4 using a heat tool connectsit to the edge of the glass substrate 1. Then exposed portions arecoated with insulating resin such as polyimide resin, epoxy resin orsilicone resin which forms a protective film 32 (FIG. 9(h)).

[0088]FIG. 10 is a schematic view showing how function modules andinput/output terminals inside the LCD controller (LSI) are laid out inthe embodiment. In FIG. 10, a common drive block 44 and a segment driverblock 45 are provided to display images on the LCD panel on a timedivision drive basis. The common driver block 44 outputs the commonvoltage via terminals COM1 through COM32 and COMS2 to the commonelectrodes 11 inside the LCD panel. The segment driver block 45 outputsthe segment voltage via terminals SEG1 through SEG60 to the segmentelectrodes 11 inside the LCD panel.

[0089] An annunciator display block 46 causes an icon or a marking toappear on the LCD panel on a static drive basis. In operation, the block46 outputs a static drive common voltage via a terminal ACOM1 to part ofthe common electrodes 12 in the LCD panel, and a static drive segmentvoltage via terminals ASEG1 through ASEG12 to part of the segmentelectrodes 11 inside the LCD panel.

[0090] When the reference potential (G_(ND)) is input to a terminal(OPOFF), an operation amplifier block 48 divides the potential betweenthe power supply potential (V_(CC)) and a second reference potential(V_(EE)) to output liquid crystal driving voltages at five levels (V1through V5). When the power supply potential (V_(CC)) is input to theterminal OPOFF, the operation amplifier block 48 is turned off. Thisallows liquid crystal driving voltages at five levels (V1 through V5) tobe input from the outside via terminals V1OUT through V5OUT. TerminalsVREFP, VREF and VREFM are used to adjust driving capabilities ofincorporated operation amplifiers in accordance with the liquid crystaldriving voltage in effect.

[0091] A booster circuit block 49 doubles (or triples) the voltage inputto a terminal VCI, and outputs the boosted voltage via a terminal V5OUT2or V5OUT3. When the terminal V5OUT2 or V5OUT3 is connected externally toa terminal VEE, the second reference potential V_(EE) is providedthereby in the LCD controller (LSI). Where the booster circuit block 49is to be used, a booster capacitor is connected interposingly betweenterminals C1 and C2.

[0092] With a resistor connected between terminals OSC1 and OSC2, anoscillator block 50 generates a clock signal used inside the LCDcontroller (LSI). If an external clock signal is to be used inside theLCD controller, the signal is input through the terminal OSC1.

[0093] A low dielectric strength buffer block 47 accommodatesinput/output buffer circuits for handling input/output signals. A lowdielectric strength logic block 51 holds registers or control circuits.A ROM block 52 and a RAM block 53 retain ROMs and RAMs respectively.

[0094] A key scan circuit control block 54 acts as a control block thatillustratively detects key input status of a portable telephone. Astrobe signal is output on a time division basis from terminals KST0through KST7, and key status is received through terminals KIN0 throughKIN3 in synchronism with the strobe signal.

[0095] A terminal IM is used to select a serial interface mode betweenthe inventive liquid crystal display module (LCM) and the centralprocessing unit (CPU). The power supply potential V_(CC) fed to theterminal IM causes clock synchronous serial interface mode to beselected. Applying the reference potential V_(EE) to the terminal IMselects I²C bus interface mode. While I²C bus interface mode is ineffect, terminals ID1/CS* and ID0 are used to set low-order two bits ofa device ID code assigned to the LCD controller (LSI). In serialinterface mode, the terminal ID1/CS* is used to receive a chip selectsignal, and the terminal ID0 is used to set a low-order one bit of thedevice ID code assigned to the LCD controller.

[0096] To set the low-order bits in the device ID code allocated to theLCD controller (LSI) requires that the terminal ID1/CS* or ID0 be alwaysfed with the power supply potential V_(CC) or reference potentialV_(EE). From now on, the terminals IM, ID1/CS* and ID0 will be calledmode terminals 41.

[0097] As shown in FIG. 11, the potential supplied to the mode terminals41 is input to a mode selector circuit 43 through a CMOS invertercircuit 42. The mode selector circuit 43 changes internal status(operation mode or device ID information) of the LCD controller (LSI) inkeeping with the potential fed to the mode terminals 41. The circuitmodules associated with the mode selector circuit 43 are located closeto the mode terminals 41, as illustrated in FIG. 10.

[0098] Next to the mode terminals 41 in FIG. 10, a power supply dummyterminal VCCDUMMY1 is provided illustratively between the terminals IMand ID0, and another power supply dummy terminal VCCDUMMY2 between theterminals ID0 and ID1/CS*. These power supply dummy terminals VCCDUMMY1and VCCDUMMY2 are connected to the wires of the power supply potentialV_(CC) inside the LCD controller (LSI). When the pad-to-pad connectionwiring 25 connects the terminals IM, ID0 and ID1/CS* to the power supplydummy terminals VCCDUMMY1 and VCCDUMMY2, the power supply potentialV_(CC) is supplied to the terminals IM, ID0 and ID1/CS*. The secondregion 24 is located close to the terminals IM, ID0 and ID1/CS*. Whenthe terminals IM, ID0 and ID1/CS* are connected to the second region 24,the reference potential G_(ND) is fed to these terminals. Sucharrangements reduce the number of input/output wires 22 needed on theglass substrate 1.

[0099]FIG. 12 is a block diagram showing function blocks inside the LCDcontroller (LSI) of the embodiment. The common driver block 44 shown inFIG. 10 comprises a common shift register 101 and a common driver 102.The common shift register 101 selects the common electrodes 12 to bedriven per unit horizontal scanning time in accordance with a timingsignal for output timing control, the timing signal being input from atiming generator circuit 110. The common driver 101 supplies theselected common electrodes 12 as well as the remaining common electrodes12 with a suitable liquid crystal driving voltage selected from amongdifferent levels of liquid crystal driving voltages coming from a liquidcrystal driving voltage selector circuit 106.

[0100] The segment driver block 45 shown in FIG. 10 includes a segmentshift register 103, a latch circuit 104 and a segment driver 105. Thesegment shift register 103 generates a display data latch signal basedon a display data latch timing signal coming from the timing generatorcircuit 110. The latch circuit 104 latches display data upon receipt ofthe display data latch signal, and outputs the latched display data tothe segment driver 105 in accordance with the timing signal for outputtiming control. The segment driver 105 supplies the segment electrodes11 each having “1” or “0” as display data for a single horizontal scan,with a suitable liquid crystal driving voltage selected from among thedifferent levels of liquid crystal driving voltages coming from theliquid crystal driving voltage selector circuit 106, the selection ofthe driving voltage being based on the display data.

[0101]FIG. 13 is a graphic representation illustrating typical behaviorof segment voltages fed to the segment electrodes 11 and of commonvoltages supplied to the common electrodes 12 under a time divisiondrive scheme of the embodiment. The liquid crystal display module (LCM)of this embodiment adopts what is known as an alternating drive scheme.Under this scheme, the liquid crystal layer 10 is protected againstapplication of DC voltages through periodical inversion of the segmentvoltage fed to a plurality of segment electrodes 11 and of the commonvoltage supplied to a plurality of common electrodes 12.

[0102] In the example of FIG. 13, suppose that negative polarity is ineffect (i.e., the segment voltage fed to the segment electrodes 11having display data “1” is lower than the common voltage applied to thecommon electrodes 12). In such a case, the segment electrodes 11 havingdisplay data “1” each are supplied with a segment voltage V5 from theliquid crystal driving voltage selector circuit 106; the segmentelectrodes 11 having display data “0” each are fed with a segmentvoltage V3 from the circuit 106; the selected common electrodes 12 aregiven a common voltage V6 by the circuit 106; and the unselected commonelectrodes 12 are provided with a common voltage V6 from the circuit106.

[0103] Suppose now that positive polarity is in effect in the example ofFIG. 13 (i.e., the segment voltage fed to the segment electrodes 11having the display data “1” is higher than the common voltage suppliedto the common electrodes 12). In that case, the segment electrodes 11having the display data “1” each are supplied with a segment voltage V6from the liquid crystal driving voltage selector circuit 106; thesegment electrodes 11 having the display data “0” each are fed with asegment voltage V2 from the circuit 106; the selected common electrodes12 are given a common voltage V5 by the circuit 106; and the unselectedcommon electrodes 12 are provided with a common voltage V1 from thecircuit 106.

[0104] The annunciator display block 46 shown in FIG. 10 includes anannunciator driver 108. The annunciator driver 108 outputs to theselected segment electrodes 11 a segment voltage whose waveform is shownin FIG. 14(b), outputs a segment voltage with its waveform indicated inFIG. 14(a) to the unselected segment electrodes 11 connected toterminals ASEG1 through ASEG12, and outputs a common voltage with itswaveform depicted in FIG. 14(c) to the common electrodes 12 connected toa terminal ACOM1.

[0105] In the above setup, no liquid crystal driving voltage is fed tothe liquid crystal layer 10 between the unselected segment electrodes 11connected to the terminals ASEG1 through ASEG12 on the one hand, and thecommon electrodes 12 connected to the terminal ACOM1 on the other hand.A liquid crystal driving voltage with a potential difference of2×(V_(CC)−A_(GND)) is applied to the liquid crystal layer 10 between theselected segment electrodes 11 connected to the terminals ASEG1 throughASEG12 on the one hand, and the common electrodes 12 connected to theterminal ACOM1 on the other hand.

[0106] The operation amplifier block 48 indicated in FIG. 10 comprises aseries resistance circuit with five resistors 121 through 125 and avariable resistor 126 connected in series, and five voltage followercircuits 131 through 135 connected to the points of connection betweenthe resistors. When the reference potential G_(ND) is input to theterminal OPOFF, the potential between the power supply potential V_(CC)and the second reference potential V_(EE) is divided so that five levelsof liquid crystal driving voltages V1 through V5 are output from thevoltage follower circuits 131 through 135.

[0107] The liquid crystal driving voltages at five levels V1 through V5and the power supply potential V_(CC) (liquid crystal driving voltageV6) are output to the liquid crystal driving voltage selector circuit106.

[0108] A booster circuit 111 and a clock signal generator circuit 112constitute respectively the booster circuit block 49 and the oscillatorblock 50 shown in FIG. 10.

[0109] A character generator ROM 153 generates five-by-eight bitcharacter patterns based on eight-bit character codes. The charactergenerator ROM 153 is included in the ROM block 52 shown in FIG. 10.

[0110] A display data RAM 154 constitutes a random access memory thatstores eight-bit character codes. A character generator RAM 152 is auser font random access memory wherein a user may rewrite characterpatterns by program as desired. A segment RAM 151 is a random accessmemory allowing a user program to control segments such as icons ormarkings as needed. The display data RAM 154, character generator RAM152 and segment RAM 151 are included in the RAM block 53 shown in FIG.10.

[0111] A cursor blink control circuit 118 is used to blink the cursor ondisplay or to reverse the displayed cursor monochromatically. Displaydata (dot data) from the cursor blink control circuit 118, segment RAM151, character generator RAM 152 and character generator ROM 153 areconverted to serial data by a parallel-serial converter circuit 107. Theconverted data are sent to the latch circuit 104. The parallel-serialconverter circuit 107 and cursor blink control circuit 118 are includedin the low dielectric strength logic block 51 shown in FIG. 10.

[0112] For a serial interface 113, either clock synchronous serialinterface mode or I²C bus interface mode is selected depending on thevoltage fed to the terminal IM. Address information and data transmittedfrom the CPU via the serial interface 113 are retained by an instructionregister 151 and a data register 153. The address information placed inthe instruction register 151 is separated by an instruction decoder 116into two kinds of address information: address information for thedisplay data RAM 154; and address information for the segment RAM 151,character generator RAM 152 and character generator ROM 153.

[0113] The address information separated by the instruction decoder 116for the segment RAM 151, character generator RAM 152 and charactergenerator ROM 153 is input to an address counter 117. With its addressinformation, the address counter 117 causes the segment RAM 151,character generator RAM 152 and character generator ROM 153 to beaccessed.

[0114] The instruction decoder 116, address counter 117, instructionregister 151, data register 153 and a busy flag 152 are included in thelow dielectric strength logic block 51 shown in FIG. 10.

[0115] LED output ports 119 comprise three LED driving ports connectedto terminals LED0 through LED2 and three general-purpose output portsconnected to terminals PORT0 through PORT2. LEDs connected to theterminals LED0 through LED2 are turned on and off by way of the serialinterface 113. The LED output ports 119 are included in the lowdielectric strength logic block 51 shown in FIG. 10.

[0116] Given a clock signal from the clock signal generator circuit 112,the timing generator circuit 110 generates a timing signal by which tooperate such internal circuits as the common shift register 101, segmentshift register 103, latch circuit 104, display data RAM 154, charactergenerator RAM 152 and segment RAM 151. The timing generator circuit 110is included in the low dielectric strength logic block 51 shown in FIG.10.

[0117] The key scan circuit control block 54 indicated in FIG. 10comprises a key scan timing control circuit 115 and a key scan register114.

[0118]FIG. 15 is a schematic view of power supply wiring inside asemiconductor integrated circuit (LSI) of the embodiment. In FIG. 15,reference numeral 61 stands for power supply wiring of the power supplypotential V_(CC), 62 for power supply wiring of the second referencepotential V_(EE), 63 for power supply wiring of the reference potentialG_(ND), and 64 for power supply wiring of a third reference potentialA_(GND). As depicted in FIG. 15, the power supply dummy terminalsVCCDUMMY1 and VCCDUMMY2 are connected to the power supply wiring 61.

[0119]FIG. 16 is a schematic view illustrating specific wiring patternsof a transparent conductive film (ITO) on that portion of the glasssubstrate 1 which carries the LCD controller (LSI), the patterns beingshown relative to the LCD controller.

[0120] In FIG. 16, the power supply potential V_(CC) is input to a powersupply potential terminal (VCC) 80, and the reference voltage G_(ND) toa reference potential terminal (GND) 82. The terminal OPOFF is connectedvia the second region 24 to the reference potential terminal (GND) 82.In this setup, the operation amplifier block 48 divides the differencebetween the power supply potential V_(CC) and the second referencepotential V_(EE) so that the voltage follower circuits output fivelevels of liquid crystal driving voltages V1 through V5.

[0121] The terminal VCI is connected to the power supply potentialterminal (VCC) 80 via the transparent conductive film (ITO) formed onthe glass substrate 1 outside the LCD controller (LSI). In thisarrangement, the booster circuit block 49 triples the power supplypotential V_(CC) and outputs the boosted potential through a terminalV5OUT3. The terminal V5OUT3 is connected to a terminal VEE (to which toinput the second reference potential V_(EE)) via the transparentconductive film (ITO) formed over the glass substrate 1 outside the LCDcontroller.

[0122] The terminal IM, one of the mode terminals 41, is connected viathe second connecting region 24 to the reference potential terminal(GND) 82. This allows the LCD controller (LSI) mounted on the wiringpatterns in FIG. 16 to exchange data with the CPU in I²C bus interfacemode. The terminal ID1/CS*, another mode terminal 41, is connected tothe power supply dummy terminal VCCDUMMY2 via the pad-to-pad connectionwiring 25. The terminal ID0, yet another mode terminal 41, is connectedto the reference potential terminal (GND) 82 via the second connectingregion 24.

[0123] In FIG. 16, the first connecting region 23 is also connected topower supply terminals (VCC) 81 shown in the top left corner. Theconnection is made because the power supply terminals (VCC) 81 areconnected inside the LCD controller (LSI) to those different powersupply wires (not shown in FIG. 15) of the power supply potential V_(CC)which are not connected to the power supply wiring 61 in FIG. 15. Thesecond connecting region 24 is also connected to reference power supplyterminals (GND) 83. This connection is made because the power supplywires 63 of the reference potential G_(ND) are divided inside the LCDcontroller (LSI) into two portions as shown in FIG. 15, the two portionsof the reference potential (G_(ND)) wires 63 being disconnected from oneanother inside the LCD controller.

[0124] In FIG. 16, terminals DMY15 through DMY18 are dummy terminals.Reference numeral 78 denotes aluminum (Al) jumper wiring. The reasonswhy the terminals DMY 15 through DMY18 as well as the aluminum jumperwiring 78 are provided where they are will be described later.

[0125]FIG. 17 is a cross-sectional view taken on line A-A′ in FIG. 16where the terminal ID1/CS* and the power supply dummy terminal VCCDUMMY2shown in FIG. 16 are connected, the view including a cross-section ofthe LCD controller (LSI). As shown in FIG. 17, the terminal ID1/CS* ismade up of an aluminum pad 74 and a gold bump 77 which permitsconnection with the transparent conductive film (ITO). The power supplydummy terminal VCCDUMMY2 is composed of an aluminum pad 75 and a goldbump 77. The gold bumps 77 are formed illustratively by deposition.

[0126] In the manner described, the terminal ID1/CS* and the powersupply dummy terminal VCCDUMMY2 are connected through the followingroute: from the aluminum pad 74 to the gold bump 77 to the pad-to-padconnection wiring (transparent conductive film (ITO)) to the gold bump77 to the aluminum pad 75. In FIG. 17, reference numeral 71 stands for awafer substrate, 72 for a field oxide film (selected silicon dioxidefilm), 73 for an interlayer film, and 76 for a protective film(passivation film).

[0127]FIG. 18 is a schematic view indicating other specific wiringpatterns of the transparent conductive film (ITO) on that portion of theglass substrate 1 which carries the LCD controller (LSI), the patternsbeing shown relative to the LCD controller. In FIG. 18, the power supplypotential V_(CC) is input to a power supply potential terminal (VCC) 85,and the reference potential G_(ND) to a reference potential terminal(GND) 87. As described above, the power supply terminal (VCC) 85 and apower supply potential terminal (VCC) 86 in the middle are not connectedinside the LCD controller (LSI). Likewise, the reference potentialterminal (GND) 87 and a reference potential terminal (GND) 88 in themiddle are not connected within the LDC controller (LSI).

[0128] In the above setup, as shown in FIG. 16, the transparentconductive film (ITO) formed on the glass substrate 1 outside the LCDcontroller is used to connect the power supply terminal (VCC) 85 to thecentrally located power supply potential terminal (VCC) 86. On the otherhand, it may be desired to connect the power supply terminal (VCC) 85 tothe power supply potential terminal (VCC) 86 in the middle by use of thetransparent conductive film (ITO) formed over the glass substrate 1which carries the LCD controller (LSI).

[0129] In the latter case, it is required to cross the first connectingregion 23 and the second connecting region 24. The crossing requirementis met in the example of FIG. 18 by furnishing a third connecting region23 a and by connecting the region 23 a with the first connecting region23 through the use of the aluminum jumper wiring 78 inside the LCDcontroller (LSI). The other arrangements are the same as those for thewiring patterns in FIG. 16.

[0130]FIG. 19 is a cross-sectional view taken on line B-B′ in FIG. 18where dummy terminals DAY16 and DAY17 shown in FIG. 18 are connected,the view including a cross-section of the LCD controller (LSI). As shownin FIG. 19, the dummy terminals DAY16 and DAY17 are interconnected viathe aluminum jumper wiring 78. Thus the power supply terminal (VCC) 85and the power supply potential terminal (VCC) 86 in the middle areconnected through the following route: from the third connecting region23 a to the gold bump 77 to the aluminum jumper wiring 78 to the goldbump 77 to the first connecting region 23.

[0131] In the inventive liquid crystal display module (LCM), as will beappreciated from FIGS. 16 and 18, the power supply wires feeding supplyvoltages to the LCD controller (LSI) can be drawn not only from themiddle of the LCD controller (LSI) but also from the latter's edge(upper or lower edge) for connection to the heat seal 4. This featureallows the liquid crystal display module (LCM) to layout its powersupply wires to better accommodate the power supply wiring arrangementson a printed circuit board used in a portable apparatus. As such, themodule can effectively address diverse kinds of printed circuit boardsincorporated in portable equipment.

[0132] Illustratively, the liquid crystal display module (LCM) embodyingthe invention may be used as a display device of a PHS system, one oftoday's portable telephone systems. FIG. 20 is a block diagram outlininga conventional PHS system that utilizes the inventive liquid crystaldisplay module (LCM).

[0133] The PHS system in FIG. 20 comprises an ADPCM CODEC circuit 201for contracting and expanding audio data, a speaker 202, a microphone203, a liquid crystal display panel 204, a keyboard 205, a TDMA circuit206 for multiplexing digital data on a time 2 division basis, an E²PROM209 for storing a registered ID number, a ROM 208 and an SRAM 207 forstoring programs, a PLL circuit 210 for establishing a radio carrierfrequency, an RF circuit 211 for sending and receiving data by radio,and a microcomputer 212 for controlling the configured components. Theinventive liquid crystal display module (LCM) may be used as the liquidcrystal display panel 204 shown in FIG. 20.

[0134]FIG. 21 is a schematic view illustrating a portable telephone thatincorporates the liquid crystal display module (LCM) embodying theinvention. This module is connected via the heat seal 4 to a printedcircuit board 92 that carries a CPU, and the assembly is installed inthe portable telephone 91.

[0135] In the inventive liquid crystal display module (LCM), asdescribed, the terminals IM and ID0 are connected to the secondconnecting region 24, and the terminal ID1/CS* is connected to the powersupply dummy terminal VCCDUMMY2 via the pad-to-pad connection wiring 25.These connections eliminate the need for drawing the terminals IM, ID0and ID1/C* up to an edge of the glass substrate 1 by use of input/outputwires 22 for connection to the heat seal 4 at the edge. This translatesinto a reduced number of input/output wires 22 furnished on the glasssubstrate 1.

[0136] As a result, the wiring patterns of the input/output wires formedby the transparent conductive film (ITO) on the glass substrate 1 areappreciably simplified. That is, the power supply potential wires andreference power supply wires do not cross ordinary signal conductorsover the glass substrate 1. This in turn simplifies the wiring patternsof the input/output wires 22. Less complicated wiring steps make itpossible to fabricate the liquid crystal display module (LCM) moresimply and at lower cost than before.

[0137] In addition, the heat seal 4 has a reduced area. The narrowedseal area translates into a reduced fabrication cost of the heat seal 4.

[0138] Furthermore, there is a reduced need for practicing complicatedrerouting of wires inside the printed circuit board connected to theliquid crystal display module (LCM). This makes it possible to reducethe area of the printed circuit board and to lower the cost of itsfabrication.

[0139] In the inventive liquid crystal display module (LCM), the powersupply wires feeding supply voltages to the LCD controller (LSI) can bedrawn not only from the middle of the LCD controller but also from thelatter's edge (upper or lower edge) for connection to the heat seal 4.This allows the liquid crystal display module (LCM) to lay out its powersupply wires to match the power supply wiring arrangements on a printedcircuit board incorporated in a portable apparatus. The module can thusdeal with diverse kinds of printed circuit boards used in portableequipment.

[0140] Given the characteristics outlined above, the liquid crystaldisplay module (LCM) of the invention contributes to enhancing degreesof freedom in arranging power supply wiring patterns. When incorporatedin the portable telephone, the inventive module helps downsize thetelephone set and lower the fabrication cost of the latter.

[0141] Although the invention has been described primarily in theapplied form of a chip-on-glass type liquid crystal display module, thisis not limitative of the invention. Alternatively, the invention mayalso be applied to a liquid crystal display device wherein an LCDcontroller and a liquid crystal display panel (LCD) are connected in achip-on-board (COB) arrangement as shown in FIG. 22, or connected in atape-carrier-package (TCP) arrangement as depicted in FIG. 23.

[0142] As another alternative, the glass substrates 1 and 2 constitutingthe liquid crystal display panel (LCD) may be replaced by polymer films.

[0143] It is not mandatory to locate the power supply dummy terminalsVCCDUMMY1 and VCCDUMMY2 next to the mode terminals 41. If the pad-to-padconnection wiring 25 has a wiring pattern shown in FIG. 24, the twodummy terminals may be located away from the mode terminals 41. It isalso possible to connect the power supply dummy terminals VCCDUMMY1 andVCCDUMMY2 to the power supply wires of a reference potential V_(GND)inside the LCD controller (LSI) so that the reference potential V_(GND)is fed to the mode terminals 41 via the pad-to-pad connection wiring 25.

[0144] This invention, when embodied in the manner described above,offers the following major benefits:

[0145] The liquid crystal display device according to the invention hasa reduced number-of input/output wires connected to the input/outputterminals of the semiconductor integrated circuit for driving the LCDpanel. The wiring patterns of the input/output wires is simplified, anddegrees of freedom in arranging such input/output wiring patterns areimproved. This translates into a smaller size and a lower fabricationcost of the liquid crystal display device than before.

[0146] The printed circuit board connected to the liquid crystal displaydevice is simplified in structure, the number of parts on the board isreduced, and the sizes of such parts are diminished. These improvementsmake it possible to lower the cost of fabricating the printed circuitboard.

[0147] Because there is less rerouting of signal conductors inside theprinted circuit board connected to the liquid crystal display device, itis possible to reduce the area of the board. The reduced area translatesinto a reduced fabrication cost of the board.

[0148] When the inventive liquid crystal display device is used onportable equipment such as the portable telephone, the equipment can bereduced in size. The diminished dimensions contribute to lowering thecost of fabricating such portable equipment.

[0149] Although the description above contains many specificities, theseshould not be construed as limiting the scope of the invention but asmerely providing illustrations of the presently preferred embodiments ofthis invention. For example, the invention may be applied to anysmall-sized communication devices such as telephone sets and otherelectronic devices in addition to the liquid crystal display device foruse with the portable telephone as described above. Thus the scope ofthe invention should be determined by the appended claims and theirlegal equivalents, rather than by the examples given.

What is claimed is:
 1. A liquid crystal display device comprising: aliquid crystal display panel; and a semiconductor integrated circuit forcontrolling and driving said liquid crystal display panel, saidsemiconductor integrated circuit further having a mode terminal fixed toeither a power supply potential or a reference potential duringoperation of said semiconductor integrated circuit; wherein saidsemiconductor integrated circuit includes power supply dummy terminalsconnected inside said semiconductor integrated circuit to either saidpower supply potential or said reference potential, and said modeterminal is connected to said power supply dummy terminals.
 2. A liquidcrystal display device according to claim 1, further comprising aplurality of mode terminals, wherein said plurality of mode terminalsand said power supply dummy terminals are disposed alternately.
 3. Aliquid crystal display device according to claim 2, wherein said liquidcrystal display panel has a pair of insulating substrates, and whereinone of said pair of insulating substrates is mounted with saidsemiconductor chip and has wiring patterns formed so as to connect saidmode terminal to said power supply dummy terminals.
 4. A liquid crystaldisplay device according to claim 3, wherein said wiring patterns areconstituted by an optically transparent conductive film.
 5. A liquidcrystal display device according to claim 4, wherein said insulatingsubstrates are glass substrates.
 6. A liquid crystal display deviceaccording to any one of claims 1 to 5, wherein said semiconductorintegrated circuit comprises a plurality of dummy terminalsinterconnected by a wiring layer inside said semiconductor integratedcircuit.
 7. A method for fabricating a liquid crystal display deviceincluding a liquid crystal display panel and a semiconductor integratedcircuit, said liquid crystal display panel having a pair of insulatingsubstrates, said semiconductor integrated circuit being mounted on oneof said insulating substrates to drive and control said liquid crystaldisplay panel, said semiconductor integrated circuit further comprisinga mode terminal and power supply dummy terminals, said mode terminalbeing fixed to either a power supply potential or a reference potentialduring operation of an integrated circuit, said power supply dummyterminals being connected to either said power supply potential or saidreference potential inside said semiconductor integrated circuit, saidmode terminal being connected to said power supply dummy terminals, saidmethod comprising at least the steps of: forming wiring patterns on saidpair of insulating substrates; injecting and sealing liquid crystalbetween said pair of insulating substrates; and bonding saidsemiconductor integrated circuit to one of said pair of insulatingsubstrates so that the wiring patterns formed on said pair of insulatingsubstrates will connect said mode terminal to said power supply dummyterminals.
 8. A method for fabricating a liquid crystal display deviceaccording to claim 6, wherein said liquid crystal display devicecomprises a plurality of mode terminals, and wherein said plurality ofmode terminals and said power supply dummy terminals are disposedalternately.
 9. A method for fabricating a liquid crystal display deviceaccording to claim 7 or 8, wherein said wiring patterns are constitutedby a transparent conductive film.
 10. A method for fabricating a liquidcrystal display device according to any one of claims 7 to 9, whereinsaid insulating substrates are glass substrates.
 11. A method forfabricating a liquid crystal display device according to any one ofclaims 7 to 10, wherein said semiconductor integrated circuit comprisesa plurality of dummy terminals interconnected by a wiring layer formedinside said semiconductor integrated circuit.
 12. A portable telephonecomprising a liquid crystal display device according to any one ofclaims 1 to 6.